1、Bidding Conditions
Overview:Equipment Procurement Project of RTA and AMOLED
Source of Funds:OK
Description of The Prepared Bidding Conditions:OK
2、Bidding Content
Bidding No:4197-2140BOETRI02/15
Project Name:Equipment Procurement Project of RTA and AMOLED
Place of Implementation:Beijing, P. R. China
List of Products:
| NO. | Product Name | Quantity | Main Technical Data | Remarks |
| 4197-2140BOETRI02/15 | Wafer Bonding | 1 | The system is mainly used for semiconductor area to wafer bond. The system should be capable to 0.35mm~1.5mm Glass, Sapphire, SiC, gallium arsenide Substrate and Si Substrate,and 35-1000μm glass, sapphire, silicon carbide, gallium arsenide, silicon material Die. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance and in the process of operating the operator has a good view. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. | CNY10000/USD1650 |
| 4197-2140BOETRI02/16 | CMP | 1 | This specification describes CMP system for chemical mechanical polishing (with cleaner). Materials to be polished include Cu, GaN, SiO2, SiCN, Si, SiC,SiNx, Ti, Ta, TiN, TaN, ITO,Resin . This system is configured with Polishing unit, cleaner unit, and EFEM. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service. | CNY5000/USD850 |
3、Qualification Requirements For Bidder
Qualifications or Performance:Bidders are legal persons or other organizations who participate in bidding. This Invitation for Bids is open to all suppliers from within the People's Republic of China (hereinafter abb. as "PRC") and all countries/areas which have regular trade relations with PRC. Bidders must pay for the bidding documents and register for the record, otherwise the bidder has no qualification to attend the bid.
Joint Bids:NOT Available
Bid without the bidding documents:NOT Available
4、Acquisition of Bidding Documents
Beginning of Selling Bidding Documents:2025-05-12
Ending of Selling Bidding Documents:2025-05-19
Sell bidding？doc？online？or？not:No
To Obtain::On-site Purchase
Place:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China or CEC E-procurement Platform(https://www.cec-ec.com.cn)
Price of Bidding Documents:￥10000/$1650
Additional Instructions:Specific time of Selling Bidding Documents:between 9:00 ~11:30 am and 13:00~16:30 pm (Beijing Time)(except holidays).The bidder should register on the website of CEC E-procurement Platform (https://www.cec-ec.com.cn) to purchasing and download the bidding documents.
5、Bid Submission
Deadline for Submitting Bids/Time of Bid Opening (Beijing Time):2025-06-04 10:00
Place of Bid:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Place of Bid Opening:CECOM Meeting Room, Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
6、Contact Details
Purchasers:BOE
Add.:NO.9, Dize Rd, BDA,Beijing, 100176, China
Contact:Mr. Li
Tel:86-10-57675680
Bidding Agency:China Electronics Commerce (Beijing) Co., Ltd
Add.:Building A, 17 Fuxing Road, Haidian District, Beijing, P. R. China.
Contact:Mr. Liu, Ms. Chang, Mr. Zhao
Tel:86-10-52200340 (Sell bidding documents), 86-10-52207732
7、Remittance Approach:
Bank(RMB):
Bank(USD):
Account NO.(RMB):
Account NO.(USD):
